• Sub250 1S BEC board top view with solder pads labeled GND, VIN and VOUT, version 1.0
  • Bottom side of BEC PCB showing IC and surface-mount components layout
  • Sub250 1S BEC angled view showing labeled GND, VIN and VOUT solder pads on top
  • Angled rear view of the BEC board with regulator chip and capacitors visible
  • Low-angle close-up of the BEC module highlighting SMD components and board thickness
  • Side profile of the BEC board showing component height and stacked PCB layers
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Sub250 1S BEC Board V1 for DJI O4 TinyWhoop Voltage Boost Module, 2.7-12V In to 5V 2A Out, 12x8mm

Sub250 1S BEC Board V1 for DJI O4 TinyWhoop Voltage Boost Module, 2.7-12V In to 5V 2A Out, 12x8mm

sub250

$14.79 USD
$14.79 USD
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Overview

The Sub250 1S BEC Board V1 is a compact voltage boost module designed for DJI O4 TinyWhoop builds, providing a regulated 5V output from a wide input range.

Key Features

  • Wide input range: 2.7v-12v
  • Regulated output: 5v
  • Continuous current: 2a
  • Compact footprint for tight micro builds
  • Pad spacing: 2mm
  • Labeled pads for wiring: VIN, VOUT, GND

For installation or compatibility questions, contact support@rcdrone.top or visit https://rcdrone.top/.

Specifications

Input Voltage 2.7v-12v
Output Voltage 5v
Continuous Current 2a
Pad Spacing 2mm
Dimensions 12mm x 8mm
Thickness 2mm
Weight 0.38g

Wiring / Pad Labels

  • VIN: power input
  • VOUT: 5V output
  • GND: ground

What’s Included

  • Sub250 1S BEC Board V1
  • 3M double-sided tape
  • Heat-shrink tube
  • Red/black hookup wires

Details

Sub250 1S BEC voltage boost module for DJI O4 1S TinyWhoop builds, compact 5V regulator board

Add a stable 5V rail to DJI O4 TinyWhoop builds with a compact Sub250 1S BEC voltage boost module.

Sub250 1S BEC specs and size diagram showing 2.7–12V input, 5V output, 2A current, 12×8mm board

A wide 2.7–12V input range boosts to regulated 5V output in a tight 12 × 8 mm footprint.

Side profile and scale weight display for the BEC board, showing 2mm thickness and 0.38g weight

At only 2 mm thick and about 0.38 g, the board fits easily in tight micro builds.

Angled front and back views of the Sub250 1S BEC board with surface-mount components and compact layoutPad label close-up of VIN, VOUT, and GND on the board for easier wiring orientation

Clear VIN, VOUT, and GND pad labels help keep wiring clean and consistent during installation.

Wiring connection example to flight controller plus included accessories: 3M tape, heat-shrink tube, and wires

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