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Jetson AGX Orin 32GB H01 Kit with 32GB Module, 200 TOPS AI, PCIe X16, GbE/10GbE, HDMI 2.1, M.2, USB 3.2, JetPack 5.1.2

Jetson AGX Orin 32GB H01 Kit with 32GB Module, 200 TOPS AI, PCIe X16, GbE/10GbE, HDMI 2.1, M.2, USB 3.2, JetPack 5.1.2

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Regular price $2,099.00 USD
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Overview

Jetson AGX Orin 32GB H01 Kit with Jetson AGX Orin 32GB Module delivers up to 200 TOPS of on-device AI performance for production-grade edge computing. The kit integrates rich interfaces including PCIe X16, GbE, 10GbE, 3× USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 16‑lane MIPI CSI‑2, and a 40‑Pin header. It is pre-installed with JetPack 5.1.2 and Linux OS BSP, supporting Jetson software and leading AI frameworks. Compact mechanical size is 107mm × 106.4mm × 70.5mm.

Product Change Log

  • 2024/11/25: A605 carrier board upgraded to V2.3 with the following modifications:
    • Changed the 5V power supply solution (TI TPS5301DGS) to address reboots caused by USB devices with high dynamic current.
    • Optimized PCB layout.
    • Replaced Wi‑Fi module with BL‑M8822CP1 and updated software driver.

Key Features

  • Brilliant AI performance for production: up to 200 TOPS with low power and low latency; up to 10× the performance of Jetson Xavier NX and up to that of Jetson AGX Xavier.
  • Hand-size edge AI device: 107mm × 106.4mm × 70.5mm; includes Jetson AGX Orin module, heatsink with cooling fan, enclosure, and power adapter.
  • Expandable I/O: PCIe X16, GbE, 10GbE, 3× USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi‑Fi and Bluetooth via pre‑installed module, 16‑lane MIPI CSI‑2, 40‑Pin header.
  • Accelerates solution deployment: pre‑installed JetPack 5.1.2, Linux OS BSP; supports Jetson software stacks and leading AI frameworks.
  • Additional interfaces visible on the carrier board: 14‑Pin header, RS485 and RS232 connectors, 2‑Pin RTC, 4‑Pin fan connector, audio jack, Force Recovery/Reset/Power buttons, microSD card slot, LED indicators, DC power in jack, and 12V/2A 2‑Pin power output.

Specifications

AI Performance 200 TOPS
GPU 1792‑core NVIDIA Ampere GPU with 56 Tensor Cores
CPU 8‑core NVIDIA Arm Cortex A78AE v8.2 64‑bit CPU, 2MB L2 + 4MB L3
Memory 32 GB 256‑bit LPDDR5, 204.8 GB/s
DL Accelerator 2 × NVDLA v2.0
Vision Accelerator 1 × PVA v2.0
Storage 64GB eMMC 5.1
Video Encoder H.265: 1× 4K60 | 3× 4K30 | 6× 1080p60 | 12× 1080p30; H.264: 1× 4K60 | 2× 4K30 | 5× 1080p60 | 11× 1080p30
Video Decoder H.265: 1× 8K30 | 2× 4K60 | 4× 4K30 | 9× 1080p60 | 18× 1080p30; H.264: 1× 4K60 | 2× 4K30 | 5× 1080p60 | 11× 1080p30
Display 1× HDMI 2.1
Camera 1× 16‑lane MIPI CSI‑2 connector
Networking 1× GbE; 1× 10GbE
USB 2× USB 3.2 Type‑A (integrated USB 2.0); 1× USB 3.2 Type‑C (integrated USB 2.0)
M.2 Key M 1× M.2 Key M
M.2 Key E 1× M.2 Key E (pre‑installed Wi‑Fi + BT: BL‑M8822CP1)
Fan 1× 4‑pin fan (5V PWM)
microSD card slot 1× microSD card slot
Audio Jack 1× 3.5mm audio jack
RTC 2‑pin RTC
RS485 1× RS485 (3P 1.5mm pitch)
RS232 1× RS232 (3P 1.5mm pitch)
Others 40‑pin header; 1× SPI bus (+3.3V level); 6× GPIO (+3.3V level); 1× CAN; Force Recovery, Reset and Power ON/OFF buttons; 12V/2A 2‑pin power output
Power Supply 9~20V DC input @ 8A
Mechanical 107mm × 106.4mm × 70.5mm
Operating Temperature ‑25 ⁰C to +70 ⁰C

What’s Included

Jetson AGX Orin 32GB ×1
Seeed carrier board ×1
Aluminum heatsink with fan ×1
Aluminum case ×1
19V/4.74A (Barrel Jack 5.5/2.5mm) power adapter ×1
Wi‑Fi/BT module (BL‑M8822CP1) x1

Applications

Ideal for autonomous systems and complex AI tasks such as image recognition, object detection, pose estimation, semantic segmentation, and video processing. Reference applications include:

Explore tools and tutorials in the Jetson Community Resources and find inspiration in the Community Projects.

Documents

Details

Jetson AGX Orin Kit offers versatile connectivity with USB, HDMI, Ethernet, M.2, GPIO, audio, microSD, and serial interfaces.

Jetson AGX Orin Kit includes USB 3.2 Type-C, HDMI 2.1, dual USB 3.2 Type-A, GbE and 10GbE, M.2 connectors, GPIO header, audio jack, microSD slot, and serial interfaces for versatile connectivity.

Jetson AGX Orin Kit, Jetson AGX Orin module with PCIe x16 connector on carrier board, part number 900-44805-0000, revision 2.2, manufactured by LEETOP.

Jetson AGX Orin Module and PCIe X16 Connector on carrier board, PN: 900-44805-0000, REV: 2.2, LEETOP.

Jetson AGX Orin Kit, Upgraded A605 carrier board to V2.3 with modifications to fix reboot issues from high-dynamic USB devices.