• Sub250 1S BEC board top view with solder pads labeled GND, VIN and VOUT, version 1.0
  • Bottom side of BEC PCB showing IC and surface-mount components layout
  • Sub250 1S BEC angled view showing labeled GND, VIN and VOUT solder pads on top
  • Angled rear view of the BEC board with regulator chip and capacitors visible
  • Low-angle close-up of the BEC module highlighting SMD components and board thickness
  • Side profile of the BEC board showing component height and stacked PCB layers
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Bodi ya Sub250 1S BEC V1 kwa DJI O4 TinyWhoop Moduli ya Kuongeza Voltage, 2.7-12V In hadi 5V 2A Out, 12x8mm

Bodi ya Sub250 1S BEC V1 kwa DJI O4 TinyWhoop Moduli ya Kuongeza Voltage, 2.7-12V In hadi 5V 2A Out, 12x8mm

sub250

$14.79 USD
$14.79 USD
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Muhtasari

Sub250 1S BEC Bodi V1 ni moduli ya kuongeza voltage yenye ukubwa mdogo iliyoundwa kwa ajili ya DJI O4 TinyWhoop, ikitoa pato lililodhibitiwa la 5V kutoka kwa anuwai pana ya ingizo.

Vipengele Muhimu

  • Anuwai pana ya ingizo: 2.7v-12v
  • Pato lililodhibitiwa: 5v
  • Mtiririko wa mara kwa mara: 2a
  • Ukubwa mdogo kwa ajili ya ujenzi wa micro wenye nafasi finyu
  • Umbali wa pad: 2mm
  • Pad zilizoandikwa kwa ajili ya wiring: VIN, VOUT, GND

Kwa maswali ya usakinishaji au ulinganifu, wasiliana na support@rcdrone.top or tembelea https://rcdrone.top/.

Maelezo ya Kiufundi

Voltage ya Ingizo 2.7v-12v
Voltage ya Pato 5v
Mtiririko wa Mara kwa Mara 2a
Umbali wa Pad 2mm
Vipimo 12mm x 8mm
Unene 2mm
Uzito 0.38g

Leibha / Lebo za Pad

  • VIN: ingizo la nguvu
  • VOUT: 5V pato
  • GND: ardhi

Nini Kimejumuishwa

  • Sub250 1S BEC Bodi V1
  • Tepe ya pande mbili ya 3M
  • Tubo la kupunguza joto
  • Nyaya za kuunganisha nyekundu/nyeusi

Maelezo

Sub250 1S BEC voltage boost module for DJI O4 1S TinyWhoop builds, compact 5V regulator board

Ongeza reli thabiti ya 5V kwa ujenzi wa DJI O4 TinyWhoop kwa moduli ya kuongeza voltage ya Sub250 1S BEC.

Sub250 1S BEC specs and size diagram showing 2.7–12V input, 5V output, 2A current, 12×8mm board

Safu pana ya ingizo la 2.7–12V inaboost hadi pato lililosimamiwa la 5V katika eneo dogo la 12 × 8 mm.

Side profile and scale weight display for the BEC board, showing 2mm thickness and 0.38g weight

Kwa unene wa 2 mm tu na uzito wa takriban 0.38 g, bodi inafaa kwa urahisi katika ujenzi wa micro wenye nafasi ndogo.

Angled front and back views of the Sub250 1S BEC board with surface-mount components and compact layoutPad label close-up of VIN, VOUT, and GND on the board for easier wiring orientation

Lebohalisi za VIN, VOUT, na GND zinasaidia kuweka wiring safi na thabiti wakati wa usakinishaji.

Wiring connection example to flight controller plus included accessories: 3M tape, heat-shrink tube, and wires

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